Showing 11–20 of 56 results

  • AMD Ryzen™ 7 7800X3D

    Physical

    Socket: AMD Socket AM5
    Foundry: TSMC
    Process Size: 5 nm
    Transistors: 6,570 million
    Die Size: 71 mm²
    I/O Process Size: 6 nm
    I/O Die Size: 122 mm²
    Package: FC-LGA1718
    tCaseMax: 61°C
    tJMax: 89°C

    Performance

    Frequency: 4.4 GHz
    Turbo Clock: up to 5 GHz
    Base Clock: 100 MHz
    Multiplier: 44.0x
    Multiplier Unlocked: Yes
    TDP: 120 W
    PPT: 142 W

    Features

    • MMX
    • SSE
    • SSE2
    • SSE3
    • SSSE3
    • SSE4A
    • SSE4.1
    • SSE4.2
    • AES
    • AVX
    • AVX2
    • AVX-512
    • BMI1
    • BMI2
    • SHA
    • F16C
    • FMA3
    • AMD64
    • EVP
    • AMD-V
    • SMAP
    • SMEP
    • SMT
    • Precision Boost 2
    • XFR 2

    Architecture

    Market: Desktop
    Production Status: Active
    Release Date: Jan 4th, 2023
    Retail Availability: Apr 6th, 2023
    Launch MSRP: $449
    Codename: Raphael
    Generation: Ryzen 7
    (Zen 4 (Raphael))
    Part#: 100-000000910
    Memory Support: DDR5-5200 MHz
    Dual-channel
    ECC Memory: Yes
    PCI-Express: Gen 5, 24 Lanes
    (CPU only)
    Chipsets: X670E, X670, B650E, B650

    Cores

    # of Cores: 8
    # of Threads: 16
    SMP # CPUs: 1
    Integrated Graphics: Radeon Graphics

    Cache

    Cache L1: 64K (per core)
    Cache L2: 1MB (per core)
    Cache L3: 96MB (shared)
  • AMD Ryzen™ 9 7900

    Physical

    Socket: AMD Socket AM5
    Foundry: TSMC
    Process Size: 5 nm
    Transistors: 13,140 million
    Die Size: 2x 71 mm²
    I/O Process Size: 6 nm
    I/O Die Size: 122 mm²
    Package: FC-LGA1718
    tCaseMax: 47°C
    tJMax: 95°C

    Performance

    Frequency: 4.3 GHz
    Turbo Clock: up to 5.4 GHz
    Base Clock: 100 MHz
    Multiplier: 37.0x
    Multiplier Unlocked: Yes
    TDP: 65 W
    PPT: 142 W

    Features

    • MMX
    • SSE
    • SSE2
    • SSE3
    • SSSE3
    • SSE4A
    • SSE4.1
    • SSE4.2
    • AES
    • AVX
    • AVX2
    • BMI1
    • BMI2
    • SHA
    • F16C
    • FMA3
    • AMD64
    • EVP
    • AMD-V
    • SMAP
    • SMEP
    • SMT
    • Precision Boost 2

    Architecture

    Market: Desktop
    Production Status: Active
    Release Date: Jan 14th, 2023
    Launch MSRP: $429
    Codename: Raphael
    Generation: Ryzen 9
    (Zen 4 (Raphael))
    Part#: 100-000000590
    Memory Support: DDR5-5200 MHz
    Dual-channel
    ECC Memory: Yes
    PCI-Express: Gen 5, 24 Lanes
    (CPU only)
    Chipsets: X670E, X670, B650E, B650

    Cores

    # of Cores: 12
    # of Threads: 24
    SMP # CPUs: 1
    Integrated Graphics: Radeon Graphics

    Cache

    Cache L1: 64K (per core)
    Cache L2: 1MB (per core)
    Cache L3: 64MB (shared)
  • AMD Ryzen™ 9 7900X3D

    Physical

    Socket: AMD Socket AM5
    Foundry: TSMC
    Process Size: 5 nm
    Transistors: 13,140 million
    Die Size: 2x 71 mm²
    I/O Process Size: 6 nm
    I/O Die Size: 122 mm²
    Package: FC-LGA1718
    tCaseMax: 47°C
    tJMax: 89°C

    Performance

    Frequency: 4.4 GHz
    Turbo Clock: up to 5.6 GHz
    Base Clock: 100 MHz
    Multiplier: 44.0x
    Multiplier Unlocked: Yes
    TDP: 120 W
    PPT: 230 W

    Features

    • MMX
    • SSE
    • SSE2
    • SSE3
    • SSSE3
    • SSE4A
    • SSE4.1
    • SSE4.2
    • AES
    • AVX
    • AVX2
    • BMI1
    • BMI2
    • SHA
    • F16C
    • FMA3
    • AMD64
    • EVP
    • AMD-V
    • SMAP
    • SMEP
    • SMT
    • Precision Boost 2
    • XFR 2

    Architecture

    Market: Desktop
    Production Status: Active
    Release Date: Jan 4th, 2023
    Retail Availability: Feb 28th, 2023
    Launch MSRP: $599
    Codename: Raphael
    Generation: Ryzen 9
    (Zen 4 (Raphael))
    Part#: 100-000000909
    Memory Support: DDR5-5200 MHz
    Dual-channel
    ECC Memory: Yes
    PCI-Express: Gen 5, 24 Lanes
    (CPU only)
    Chipsets: X670E, X670, B650E, B650

    Cores

    # of Cores: 12
    # of Threads: 24
    SMP # CPUs: 1
    Integrated Graphics: Radeon Graphics

    Cache

    Cache L1: 64K (per core)
    Cache L2: 1MB (per core)
    Cache L3: 128MB (shared)
    3D V-Cache: 1x 64MB Slice
  • AMD Ryzen™ 9 7950X

    Physical

    Socket: AMD Socket AM5
    Foundry: TSMC
    Process Size: 5 nm
    Transistors: 13,140 million
    Die Size: 2x 70 mm²
    I/O Process Size: 6 nm
    I/O Die Size: 124.7 mm²
    Package: FC-LGA1718
    tCaseMax: 47°C
    tJMax: 100°C

    Performance

    Frequency: 4.5 GHz
    Turbo Clock: up to 5.7 GHz
    XFR: 5.85 GHz
    Base Clock: 100 MHz
    Multiplier: 45.0x
    Multiplier Unlocked: Yes
    TDP: 170 W
    PPT: 230 W

    Features

    • MMX
    • SSE
    • SSE2
    • SSE3
    • SSSE3
    • SSE4A
    • SSE4.1
    • SSE4.2
    • AES
    • AVX
    • AVX2
    • AVX-512
    • BMI1
    • BMI2
    • SHA
    • F16C
    • FMA3
    • AMD64
    • EVP
    • AMD-V
    • SMAP
    • SMEP
    • SMT
    • Precision Boost 2
    • XFR 2

    Architecture

    Market: Desktop
    Production Status: Active
    Release Date: Sep 27th, 2022
    Launch MSRP: $699
    Codename: Raphael
    Generation: Ryzen 9
    (Zen 4 (Raphael))
    Part#: 100-000000514
    Memory Support: DDR5-5200 MHz
    Dual-channel
    ECC Memory: Yes
    PCI-Express: Gen 5, 24 Lanes
    (CPU only)
    Chipsets: X670E, X670, B650E, B650

    Cores

    # of Cores: 16
    # of Threads: 32
    SMP # CPUs: 1
    Integrated Graphics: Radeon Graphics

    Cache

    Cache L1: 64K (per core)
    Cache L2: 1MB (per core)
    Cache L3: 64MB (shared)
  • AMD Ryzen™ 9 7950X3D

    Physical

    Socket: AMD Socket AM5
    Foundry: TSMC
    Process Size: 5 nm
    Transistors: 13,140 million
    Die Size: 2x 71 mm²
    I/O Process Size: 6 nm
    I/O Die Size: 122 mm²
    Package: FC-LGA1718
    tCaseMax: 47°C
    tJMax: 89°C

    Performance

    Frequency: 4.2 GHz
    Turbo Clock: up to 5.7 GHz
    Base Clock: 100 MHz
    Multiplier: 42.0x
    Multiplier Unlocked: Yes
    TDP: 120 W
    PPT: 230 W

    Features

    • MMX
    • SSE
    • SSE2
    • SSE3
    • SSSE3
    • SSE4A
    • SSE4.1
    • SSE4.2
    • AES
    • AVX
    • AVX2
    • AVX-512
    • BMI1
    • BMI2
    • SHA
    • F16C
    • FMA3
    • AMD64
    • EVP
    • AMD-V
    • SMAP
    • SMEP
    • SMT
    • Precision Boost 2
    • XFR 2

    Architecture

    Market: Desktop
    Production Status: Active
    Release Date: Jan 4th, 2023
    Retail Availability: Feb 28th, 2023
    Launch MSRP: $699
    Codename: Raphael
    Generation: Ryzen 9
    (Zen 4 (Raphael))
    Part#: 100-000000908
    Memory Support: DDR5-5200 MHz
    Dual-channel
    ECC Memory: Yes
    PCI-Express: Gen 5, 24 Lanes
    (CPU only)
    Chipsets: X670E, X670, B650E, B650

    Cores

    # of Cores: 16
    # of Threads: 32
    SMP # CPUs: 1
    Integrated Graphics: Radeon Graphics

    Cache

    Cache L1: 64K (per core)
    Cache L2: 1MB (per core)
    Cache L3: 128MB (shared)
    3D V-Cache: 1x 64MB Slice
  • Corsair ICUE 5000X RGB QL Edition Cabinet (True White)

    Features:

    The CORSAIR iCUE 5000X RGB QL Edition Mid-Tower Case includes four pre-installed QL120 RGB fans and an iCUE Lighting Node CORE, in a stunning all-white 5000X RGB case.

    STUNNING ALL-WHITE FINISH

    The perfect match for your standout white system build.

    UNPARALLELED LIGHTING

    Equipped with four premium iCUE QL120 RGB fans* boasting 136 individually addressable RGB LEDs, your build will radiate even more spellbinding colors and unparalleled lighting effects, while reaching speeds of up to 1,500 RPM.

    With four distinct light loops per fan, your lighting will look spectacular from any angle.

    CLEAR, CLEAN, AND COOL

    Four tempered glass panels show off your showpiece-worthy PC, while generous dust-filtered air channels provide minimal obstruction and ample airflow.

    Smart rgb lighting out-of-the-box

    Fully control and synchronize the RGB lighting for up to six fans with the included iCUE Lighting Node CORE and CORSAIR iCUE software.

    Explore some iCUE profiles on the 5000X RGB QL.

    Extreme Cooling

    Maximum Cooling Potential: A spacious interior fits up to 10x 120mm or 4x 140mm cooling fans, along with multiple radiators including up to a 360mm in front and a 360mm push/pull in the roof.

    Modern Front Panel I/O

    Puts your connections within easy reach, including a USB 3.1 Type-C port, 2x USB 3.0 ports, and a combination audio/microphone jack.

    Specifications:

    Maximum GPU Length (mm) 400
    Maximum PSU Length (mm) 250
    Maximum CPU Cooler Height (mm) 170
    Expansion Slots 7 vertical + 2 horizontal
    Case Drive Bays (x2) 3.5in (x4) 2.5in
    Form Factor MID TOWER
    Case Windowed Tempered Glass
    Color WHITE
    Radiator Compatibility 120mm, 140mm, 240mm, 280mm, 360mm
    Case Front IO (1x) USB 3.1 Type C, (2x) USB 3.0, (1x) Audio in/out
    Compatible Corsair Liquid Coolers H55, H60, H75, H80i, H90, H100i, H105, H110i, H115i, H150i
    Case Power Supply ATX
    Weight 14.1
    Height (mm) 521
    Length (mm) 520
    Width (mm) 245
    Warranty 2 Years
    Note *** Features, Price, Specifications are subject to change without notice.

     

    • SERIES 5000
    • TYPE MID TOWER
    • 3.5″ BAYS 2
    • 2.5″ BAYS 4
    • EXPANSION SLOTS 7 + 2
    • MAX RADIATOR SUPPORT 360
    • MAX FAN SUPPORT 10
    • COLOR WHITE
    • SIDE PANEL TEMPERED GLASS
    • MOTHERBOARD SUPPORT ATX
    • WARRANTY 2 Years
  • Crucial BX500 240GB 3D NAND SATA 2.5-inch SSD

    Product Specifications

    SSD series – BX500
    Interface – SATA (6Gb/s)
    Capacity – 240GB
    Form factor – 2.5-inch (7mm)
    Sequential Read – 540 MB/s
    Sequential Write – 500 MB/s
    SSD Endurance (TBW) – 80TB
    Warranty – Limited 3-year
  • Crucial MX500 4TB 3D NAND SATA 2.5-inch 7mm (with 9.5mm adapter) Internal SSD

    Product Specifications

    SSD series – MX500
    Interface – SATA (6Gb/s)
    Capacity – 4TB
    Form factor – 2.5-inch (7mm)
    Sequential Read – 560 MB/s
    Sequential Write – 510 MB/s
    SSD Endurance (TBW) – 1,000TB
    Warranty – Limited 5-year
  • Intel Celeron® Processor G6900 (4M Cache- 3.40 GHz)

    Essentials
    Product Collection,Intel® Celeron® Processor G Series
    Code Name,Products formerly Alder Lake
    Vertical Segment,Desktop
    Processor Number, G6900
    Lithography, Intel 7
    Use Conditions, PC/Client/Tablet

    CPU Specifications
    Total Cores,2
    # of Performance-cores, 2
    # of Efficient-cores,0
    Total Threads,2
    Performance-core Base Frequency,3.40 GHz
    Cache,4 MB Intel® Smart Cache
    Total L2 Cache,2.5 MB
    Processor Base Power,46 W

    Supplemental Information
    Marketing Status,Launched
    Launch Date,Q1’22
    Embedded Options Available,Yes

    Memory Specifications
    Max Memory Size (dependent on memory type),128 GB
    Memory Types,Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s
    Max # of Memory Channels,2
    Max Memory Bandwidth,76.8 GB/s

    Processor Graphics
    Processor Graphics,Intel® UHD Graphics 710
    Graphics Base Frequency,300 MHz
    Graphics Max Dynamic Frequency,1.30 GHz
    Graphics Output,eDP 1.4b | DP 1.4a | HDMI 2.1
    Execution Units,16
    Max Resolution (HDMI),4096 x 2160 @ 60Hz
    Max Resolution (DP),7680 x 4320 @ 60Hz
    Max Resolution (eDP – Integrated Flat Panel)‡,5120 x 3200 @ 120Hz
    DirectX* Support,12
    OpenGL* Support,4.5
    OpenCL* Support,3.0
    Multi-Format Codec Engines,1
    Intel® Quick Sync Video,Yes
    Intel® Clear Video HD Technology,Yes
    No. of Displays Supported,4
    Device ID, 0x4693

    Expansion Options
    Direct Media Interface (DMI) Revision,4.0
    Max # of DMI Lanes,8
    Scalability,1S Only
    PCI Express Revision,5.0 and 4.0
    PCI Express Configurations ‡,Up to 1×16+4 | 2×8+4
    Max # of PCI Express Lanes,20

    Package Specifications
    Sockets Supported,FCLGA1700
    Max CPU Configuration, 1
    Thermal Solution Specification, PCG 2020C
    TJUNCTION,100°C
    Package Size,45.0 mm x 37.5 mm

    Advanced Technologies
    Intel® Gaussian & Neural Accelerator,3.0
    Intel® Thread Director,No
    Intel® Deep Learning Boost (Intel® DL Boost),Yes
    Intel® Optane™ Memory Supported,Yes
    Intel® Speed Shift Technology,Yes
    Intel® Turbo Boost Max Technology 3.0,No
    Intel® Turbo Boost Technology,No
    Intel® Hyper-Threading Technology,No
    Intel® 64,Yes
    Instruction Set, 64-bit
    Instruction Set Extensions,Intel® SSE4.1 | Intel® SSE4.2 | Intel® AVX2
    Idle States,Yes
    Enhanced Intel SpeedStep® Technology,Yes
    Thermal Monitoring Technologies,Yes
    Intel® Volume Management Device (VMD),Yes

    Security & Reliability
    Intel® Control-Flow Enforcement Technology,Yes
    Intel® AES New Instructions,Yes
    Secure Key,Yes
    Intel® OS Guard,Yes
    Execute Disable Bit,Yes
    Intel® Boot Guard,Yes
    Mode-based Execute Control (MBEC),Yes
    Intel® Virtualization Technology (VT-x),Yes
    Intel® Virtualization Technology for Directed I/O (VT-d) ,Yes
    Intel® VT-x with Extended Page Tables (EPT),Yes

  • Intel® Core™ i3-12100 Processor (12M Cache- up to 4.30 GHz)

    Essentials
    Product Collection,12th Generation Intel® Core™ i3 Processors
    Code Name,Products formerly Alder Lake
    Vertical Segment,Desktop
    Processor Number,i3-12100
    Marketing Status,Launched
    Launch Date,Q1’22
    Lithography,Intel 7
    Use Conditions,PC/Client/Tablet

    CPU Specifications
    Total Cores,4
    # of Performance-cores,4
    # of Efficient-cores,0
    Total Threads,8
    Max Turbo Frequency,4.30 GHz
    Performance-core Max Turbo Frequency,4.30 GHz
    Performance-core Base Frequency,3.30 GHz
    Cache,12 MB Intel® Smart Cache
    Total L2 Cache,5 MB
    Processor Base Power,60 W
    Maximum Turbo Power,89 W

    Supplemental Information
    Embedded Options Available,Yes
    Datasheet,View now

    Memory Specifications
    Max Memory Size (dependent on memory type),128 GB
    Memory Types,Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s
    Max # of Memory Channels,2
    Max Memory Bandwidth,76.8 GB/s

    Processor Graphics
    Processor Graphics,Intel® UHD Graphics 730
    Graphics Base Frequency,300 MHz
    Graphics Max Dynamic Frequency,1.40 GHz
    Graphics Output,eDP 1.4b | DP 1.4a | HDMI 2.1
    Execution Units,24
    Max Resolution (HDMI),4096 x 2160 @ 60Hz
    Max Resolution (DP),7680 x 4320 @ 60Hz
    Max Resolution (eDP – Integrated Flat Panel),5120 x 3200 @ 120Hz
    DirectX* Support,12
    OpenGL* Support,4.5
    OpenCL* Support,3.0
    Multi-Format Codec Engines,1
    Intel® Quick Sync Video,Yes
    Intel® Clear Video HD Technology,Yes
    # of Displays Supported ,4
    Device ID,0x4692

    Expansion Options
    Direct Media Interface (DMI) Revision,4.0
    Max # of DMI Lanes,8
    Scalability,1S Only
    PCI Express Revision,5.0 and 4.0
    PCI Express Configurations ,Up to 1×16+4 | 2×8+4
    Max # of PCI Express Lanes,20

    Package Specifications
    Sockets Supported,FCLGA1700
    Max CPU Configuration,1
    Thermal Solution Specification,PCG 2020C
    TJUNCTION,100°C
    Package Size,45.0 mm x 37.5 mm

    Advanced Technologies
    Intel® Gaussian & Neural Accelerator,3.0
    Intel® Thread Director,No
    Intel® Deep Learning Boost (Intel® DL Boost),Yes
    Intel® Optane™ Memory Supported ,Yes
    Intel® Speed Shift Technology,Yes
    Intel® Turbo Boost Max Technology 3.0 ,No
    Intel® Turbo Boost Technology ,2.0
    Intel® Hyper-Threading Technology ,Yes
    Intel® 64 ,Yes
    Instruction Set,64-bit
    Instruction Set Extensions,Intel® SSE4.1 | Intel® SSE4.2 | Intel® AVX2
    Idle States,Yes
    Enhanced Intel SpeedStep® Technology,Yes
    Thermal Monitoring Technologies,Yes
    Intel® Volume Management Device (VMD),Yes

    Security & Reliability
    Intel® Threat Detection Technology (TDT),Yes
    Intel® Standard Manageability (ISM) ,Yes
    Intel® Control-Flow Enforcement Technology,Yes
    Intel® AES New Instructions,Yes
    Secure Key,Yes
    Intel® OS Guard,Yes
    Execute Disable Bit ,Yes
    Intel® Boot Guard,Yes
    Mode-based Execute Control (MBEC),Yes
    Intel® Virtualization Technology (VT-x) ,Yes
    Intel® Virtualization Technology for Directed I/O (VT-d) ,Yes
    Intel® VT-x with Extended Page Tables (EPT) ,Yes